Semiconductor industry is a part of electronic information industry, which is based on semiconductor development of an industry.
The semiconductor industry plays an important and positive role in the development of society. The application of laser technology to the semiconductor industry can promote its transformation and development and integrate into the world development trend.
Laser technology Laser is a kind of radiation due to the stimulation of the light, it has high brightness, good monochromatism, good directivity and other characteristics.
Laser technology has a wide range of applications.
It can not only be used for laser cutting technology, laser processing technology, laser welding, laser drilling, but also can be used in laser surgery, laser weapons and laser energy applications.
Because of the laser time control and space control are better, there is no limit to the processing environment, the size, shape and material of the processing object, so it is widely used in automatic processing.
一.Application of laser technology in wafer/chip processing field
1. Application in the field of scribing
The wafer processing is part of the packaging of wafer processing. It is not only one of the key technologies for chip packaging, but also a landmark process for the transition from wafer level processing (i.e., the whole wafer is processed at the same time) to chip level processing (i.e., the wafer is processed at the same time).
From the point of view of function, the chip process separates many chips from each other by cutting the street reserved on the wafer, and makes the last preparation for the subsequent formal chip packaging.
2. Application in the wafer cutting round application
Cutting-round technology is an important part in crystal processing.
In the early stage, this technique was mainly used for shaping horizontal gallium arsenide wafers, and horizontal gallium arsenide wafers were called wafers.
With the gradual processing of each process of crystal processing, there will be various types of waste wafers in each process. These waste wafers will be processed into small diameter wafers, and then processed through some wafer processing processes, so that it becomes polished wafers.
The traditional cutting round processing methods include vertical knife cutting round method, cutting round method, sand blasting method and so on.
These methods cause great damage to the wafer in the process of processing and the wafer output is relatively small.
With the development of laser processing technology, some manufacturers of laser processing technology into the circular cutting process, coupled with more mature software control, can be processed on a chip out of more small diameter chip.
二、 Laser marking technology
Laser marking is a new marking technology which is non - contact, non - pollution and non - wear.In recent years, with the improvement of the reliability and practicability of laser, coupled with the rapid development of computer technology and the improvement of optical devices, the development of laser marking technology has been promoted.
Laser marking is the use of high energy density of the laser beam on the target, the target surface physical or chemical changes, so as to obtain the visible pattern marking way.The high-energy laser beam is focused on the surface of the material, causing the material to vaporize rapidly, forming pits.As the laser beam moves regularly across the surface of the material and controls the breaking of the laser, the beam is machined into a specified pattern on the surface of the material.Compared with traditional marking technology, laser marking has obvious advantages:
(a) Fast marking speed, clear handwriting and permanence;
(b) Non-contact processing, little pollution, no wear;
(c) Easy to operate and strong anti-counterfeiting function;
(d) High speed automatic operation and low production cost can be achieved.
In the process of wafer processing, the laser marking code is made at the specific position of the wafer, which can effectively enhance the traceability of the wafer, and also provide some convenience for the production management.
At present, making laser identifiers on wafers is a potential industry standard, which is widely used in silicon and germanium materials.