In recent years, high-tech 3C electronic products have constantly refreshed people's sights. At the same time, domestic 3C electronic products are also in a stable development stage, and the most demanded terminals in the market are still smart phones, mobile power supplies, tablets and laptops. Driven by the growing demand in 5G smart phones, wearable devices, drones, service robots and other fields, semiconductor microelectronics has become a major growth point in the 3C market.
Due to the small heat concentration and low thermal stress in the heat-affected zone of laser welding, it shows unique advantages in the packaging of integrated circuits and semiconductor device casings. Commonly used welding methods in the manufacturing process of microelectronic devices in the electronics industry include brazing, wave soldering, resistance welding, flash welding, thermal welding, ultrasonic welding, metal ball welding, capacitor energy storage welding, etc. Due to the strong directivity and high monochromaticity of the laser, it can be focused into a small high-energy spot through the optical path system, which has become another welding process for the manufacture of electronic industrial components. With the rapid development of laser technology, laser welding technology has been greatly developed, and its application fields have become more and more extensive. Especially in modern integrated circuit manufacturing, laser welding shows the advantages that other welding methods cannot match.
Electronic components are the basic components in electronic circuits, usually packaged separately, with two or more leads or metal contacts. Electronic components must be connected to each other to form electronic circuits with specific functions, such as amplifiers, radio receivers, oscillators, etc. One of the common methods of connecting electronic components is soldering to a printed circuit board.
Soldering tiny electronic components on dense PCBs is a headache for many technicians. The traditional soldering iron tip is not only difficult to operate, low in efficiency, but also prone to false soldering and missing soldering. Laser micro welding technology perfectly solves these problems. Laser welding equipment is mainly composed of three types of machines: tin wire, solder paste, and solder balls. It is the representative equipment of modern laser micro welding technology, the smallest solder joint can be as thin as 0.02 mm
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Forced laser welding technology has the advantages of fast welding speed, small deformation, sustainable production and high density. The laser welding equipment is easy to operate, can complete production tasks with quality and quantity in harsh environments, and has been fully applied in the electronics industry. The wide application of laser welding equipment can effectively speed up the circulation of innovative products and is the main weapon to promote industrial modernization