3C is the English abbreviation for computer, communication and consumer electronics. Hardware devices such as computers, tablet computers, mobile phones, digital cameras, walkmans, electronic dictionaries, audio and video players, or digital audio players. All belong to 3C electronic products. These products are rich in categories and convenient for people's lives. With the continuous development of technology and economy, people's requirements for these products are getting higher and higher. People demand these products to be more powerful, lighter in weight, thinner in appearance and more convenient in design. Based on these needs, new materials and new processes are constantly being improved. Laser technology makes the manufacturing process of 3C electronic products develop rapidly. The application of laser in the field of 3C electronics is mainly reflected in three aspects: laser marking, laser cutting and laser soldering.
1. Laser marking
Laser marking is a marking method that uses a high-energy density laser to locally irradiate the workpiece to vaporize or discolor the surface material, thereby leaving a permanent mark. Laser marking can print various characters, symbols and patterns, and the size of the characters can range from millimeters to micrometers, which is of special significance for the anti-counterfeiting of products.
The application of laser marking technology in the field of 3C electronics includes two-dimensional code marking, LOGO marking, card slot marking, charger marking and charging line marking.
2. Laser cutting
Laser cutting can be used for precision cutting or micro-hole processing of small workpieces such as metal or non-metal parts. It has the advantages of high cutting accuracy, high speed, and low thermal impact.
The application of laser cutting technology in the field of 3C electronics includes: sapphire glass mobile phone screen laser cutting, camera protection lens laser cutting, mobile phone home button laser cutting, FPC flexible printed circuit board laser cutting, screen protection film cutting, metal shell LOGO cutting, mobile phone printing Hole cutting.
3. Laser soldering
Nowadays, most 3C electronic products are moving in the direction of being lighter and thinner. The internal components of the products are getting smaller and smaller, the precision and electronic integration are getting higher and higher, and the welding process requirements for the internal components are also increasing. high.
Laser soldering belongs to non-contact processing, with small thermal shock, small processing area and flexible methods. In the current production process of high-end mobile phones and digital products and equipment, laser soldering technology plays an important role in product volume optimization and quality improvement, making products lighter, thinner, and more stable, so it has been widely used.
The application of laser soldering technology in the field of 3C electronics includes: LOGO welding, home button welding, motor welding, antenna welding, camera bracket welding, mobile phone welding, charging socket welding, internal component stud welding, bell/vibration conversion key welding.
With the advent of the 5G era, the 3C electronics industry will usher in a new revolution. Laser will be widely used from the processing of 3C electronic parts to the entire drilling, cutting, marking and tracking.